We learned the first details about the next MediaTek offer intended for middle-class phones. It is not surprising that MediaTek wants to further develop its very popular Dimensity series when 9000 series are very popular.
The new system will be MediaTek Dimensity 7000. The largest player on the factory market, ie TSMC, will be responsible for the production of the new product. The new chip will appear in 2022.
This SoC will be made on the basis of 5 nm technology and will try to compete with the Snapdragon 870. The technical parameters of the future single-chip system have not yet been determined. Anyway, Dimensity 7000 has already been spotted on AnTuTu. The result of the mobile platform was 750,000 points. It is not known with which smartphone the processor was tested. One of the first smartphones with a MediaTek Dimensity 7000 processor will be the Redmi K50 variant, codenamed Rubens.
The MediaTek Dimensity 7000 will be manufactured using TSMC’s 5nm process. This places the processor between Dimensity 1200 which is manufactured using a 6nm process and the newly announced Dimensity 9000 which is based on a 4nm process.
Last rumors says that new CPU will support 5G network, double sim and according yo the report from tipster Digital Chat Station, the MediaTek Dimensity 7000 supports 75W charging.
