The Koreans today announced that they have started mass production of the industry's first module that integrates LPDDR5 and UFS 3.1 NAND memory, i.e. RAM and flash memory, dedicated to system and user files in a single chip!
Samsung announces a new multi-chip uMCP memory package for smartphones based on LPDDR5 and UFS 3.1. The component, which will soon appear in mid-shelf models, offers a 50% increase in performance compared to previously used DRAMs and a double increase in transfer speed in NAND flash memory. The chip set went into a small 11.5 x 13 mm housing, in which there was a lot of space for additional elements. Everything indicates that medium and high segment devices using the 5G standard are facing a solid performance leap. Moreover, the new uMCP will not be reserved only for Samsung devices. The company will also make it available to other smartphone manufacturers.
photo Samsung
The multi-chip uMCP package combining LPDDR5 with UFS 3.1 NAND memory has just been announced by the South Korean tech giant and is ready for mass production if you believe the assurances. The component will be used in smartphones of global brands from the middle and higher price range. The said component offers significant progress compared to the solutions used so far. Based on DRAM and NAND, uMCP will ensure more efficient work with streaming, AR technologies, and graphically advanced games.
The new uMCP module is based on the latest mobile DRAM and NAND interfaces and - according to the manufacturer's declaration - is able to deliver lightning-fast speed and high capacity with very low demand for battery power!
photo Samsung
The new uMCP unit combines DRAM (6 to 12 GB) and NAND (128 to 515 GB) into a single element measuring 11.5 x 13 mm, which saves space. The described solution allows you to increase the DRAM performance from 17 GB / s to as much as 25 GB / s, which gives an almost 50% increase. Compared to UFS 2.2 with LPDDR4X, we will experience a doubling of the NAND memory speed from 1.5 GB / s to 3 GB / s.
